Samsung Electro-Mechanics Signs MOU with Sumitomo Chemical Group to Establish a Joint Venture for “Glass Core” Used in Package Substrates

Samsung Electro-Mechanics/KR signed a memorandum of understanding (MOU) with Sumitomo Chemical Group/JP to establish a joint venture for manufacturing “Glass Core”, a key material for next-generation semiconductor package substrates.

The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC). “Glass Core” is a core material for next-generation semiconductor package substrates and is regarded as an essential technology for realizing high-density, large-area advanced semiconductor package substrates, thanks to its lower coefficient of thermal expansion and superior flatness compared to conventional organic substrates.

Through this MOU, Samsung Electro-Mechanics, Sumitomo Chemical, and Dongwoo Fine-Chem will leverage their respective technological strengths and global networks to establish manufacturing and supply capabilities for “Glass Core” and accelerate market expansion.

In the joint venture, Samsung Electro-Mechanics will serve as the primary investor with a majority stake, while Sumitomo Chemical Group will participate as a minority shareholder. The companies plan to finalize details such as the shareholding structure, business schedule, and corporate name, aiming to sign the main agreement next year. The headquarters will be located at Dongwoo Fine-Chem’s Pyeongtaek site, which will also serve as the initial production base for “Glass Core”.

Samsung Electro-Mechanics is currently producing glass package substrate prototypes at its Sejong plant pilot line. Mass production is planned to begin with the joint venture after 2027.

www.sumitomo-chem.co.jp

www.samsungsem.com


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