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Execentis Banner April 2026

When Hardness Meets Precision: Innovative Machining of Technical Ceramics for Semiconductor Manufacturing by LCP GmbH

The handling of wafers for the semiconductor industry plays just as important a role in the quality of components as the actual machining process itself. Maximum precision and low wear are essential require­ments here. High-performance ceramics such as silicon carbide (SiC), silicon nitride (SiN), and similar materials are ideal for this application thanks to their properties such as high fracture toughness and low thermal expansion. However, the advantages of these technical ceramics are accompanied by properties such as very high hardness or high strength, which make machining them very challenging. Alternative methods such as laser machining offer a solution here. Depending on the ceramic, material thickness, and geometry, various laser technologies are available to achieve the best possible processing results. LCP Laser-Cut-Processing GmbH offers many of these technologies in-house. This article focuses on water-jet-guided laser machining and its application to SiC and SiN.

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